Murata Launches World's Smallest 100NF MLCC Ceramic Capacitor for 5G Smart Phones
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Murata Manufacturing Co., Ltd. has developed the GRM011R60J104M, the world’s first multi-layer ceramic capacitor to feature a maximum capacitance of 0.1µF in 008004 inch size (0.25×0.125mm). Mass production of this new product is scheduled to begin in 2020.
Specifications
more information: product details site
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That's really great....What about the other values of capacitances?? May they must name a different package size like 0204
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@kowshik1729 Yes, they have other cap values too , check the product website .
The package specification code is GRM011008004 .
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Welcome to the Second edition of MakerGram Live, a newsletter where we pull together information about Interesting projects, Industry news, upcoming events, job opportunities and other interesting bits that you may find useful.
If you are a member of makergram, you already received a mail, please check your inbox or you can read from here: MakerGram Live | May 2020 Maker Update
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Welcome to the Second edition of MakerGram Live, a newsletter where we pull together information about Interesting projects, Industry news, upcoming events, job opportunities and other interesting bits that you may find useful.
If you are member of makegram, you already received a mail, please check your inbox or you can read from here: MakerGram Live | May 2020 Maker Update
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Welcome to the first edition of MakerGram Live, a newsletter where we pull together information about Interesting projects, Industry news, upcoming events, job opportunities and other interesting bits that you may find useful.
You can read the April 2020 Newsletter here
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Version 2.0 of the CERN Open Hardware Licence has been released, introducing three variants meant to cater to different collaborative models
CERN Open Hardware Licence (OHL) is a legal framework to facilitate knowledge exchange on hardware design. Several years after its first publication in 2011, CERN released version 2.0 of the CERN Open Hardware Licence (CERN-OHL) in 2020, which governs the use, copying, modification and distribution of hardware design documentation, and the manufacture and distribution of any resulting products. The latest version uses simpler terminology, introduces three variants of the licence, and broadens its range to include designs that go from artistic to mechanical to electronic, as well as adapting the licence to cases such as application-specific integrated circuits (ASICs) and field-programmable gate arrays (FPGAs). It can even be used to license software.
more details: https://kt.cern/ohlv2